TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips

TSMC plans to integrate HBM4 with system-on-wafer designs in 2027.

Apr 26, 2024 - 15:50

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TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips

TSMC plans to integrate HBM4 with system-on-wafer designs in 2027.

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