Revolutionary Samsung tech that enables stacking HBM memory on CPU or GPU arrives this year — SAINT-D HBM scheduled for 2024 rollout, says report
Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology.
![Revolutionary Samsung tech that enables stacking HBM memory on CPU or GPU arrives this year — SAINT-D HBM scheduled for 2024 rollout, says report](https://cdn.mos.cms.futurecdn.net/jjNZ3ye3aTL4odrMndAc4d.png?#)
Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology.
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